Differential contact probe including ground mechanism and associated methods

ABSTRACT

A handheld differential contact probe includes a housing configured to be held in a hand of a user, a pair of probe arms carried by the housing, and a pair of opposing probe tip assemblies each carried by one of the respective probe arms and each having a probe tip circuit coupled to a probe tip at a distal end thereof. A probe tip span adjustment mechanism is carried by the housing and coupled to the pair of probe arms, and configured to adjust a span between the probe tips. A ground path mechanism is coupled between the probe tip circuits of the respective probe tip assemblies, and includes a pair of curved conductive ribbon springs each coupled at an outer end thereof to a respective probe tip circuit, and each curved conductive ribbon spring slidably engaging each other at a respective inner end thereof.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation under 37 C.F.R. § 1.53(b)(1) ofcommonly owned U.S. patent application Ser. No. 14/611,663 (nowallowed), filed Feb. 2, 2015, which names Jason Swaim as an inventor.The present application claims priority under 35 U.S.C. § 120 to U.S.patent application Ser. No. 14/611,663, the disclosure of which ishereby specifically incorporated by reference in its entirety.

BACKGROUND

Differential voltage contact probes typically transition twouncontrolled transmission lines (i.e. the probe tips) into a morecontrolled structure such as controlled impedances on a printed circuitboard (PCB) or coaxial cables. “Browser” type probes are typicallyhand-held and therefore have some compliance or “give” to ensurereliable contact and also adjustable span to accommodate probing ofdifferent physical geometries. Due to these multiple degrees of freedoma mechanism may be required to maintain the ground of the transmissionline at this transition point. An ideal mechanism may have many possiblejobs depending on the exact implementation of the probe systemincluding: maintain good electrical contact through full spanadjustment; maintain a low inductance ground path (to maximizeelectrical performance); minimize the loop area of the probe (thusmaximizing electrical performance); be robust and not easily damaged bythe user; allow for “z-axis” compliance, or compliance normal to theprobe tips (and still maintain electrical contact); allow for a verylarge number of span adjustments; be easy to assemble; and have a lowmaterial cost. These probes are typically used with oscilloscopes.

Performing all of these jobs effectively with a single mechanism may beone of the primary challenges in designing and building a browser typeprobe.

Keysight Technologies Inc. (the present Assignee) currently offersvarious differential, hand-held browser probes. The N5382A probe has noground mechanism since the PCB ground provides a low inductance groundconnection, and the tip wires transition directly into the PCB with atip network and then into controlled impedance transmission lines. Thespan adjustment on this browser probe relies on bending the springwires. Another Keysight browser probe is the E2675A. This browser probeuses a rotation-based ground mechanism and has a very large loop area.Keysight also sells the N5445A, which is a high-performance browserprobe. The ground mechanism on this browser uses two flat, slidingblades each of which is connected to one probe arm while sliding againstthe other probe arm as the span is adjusted. This results in a good lowinductance ground and very small loop area. The blades are designed tobe user-replaceable. However, at small span widths, the excess groundblade dangles in space and can affect use of the probe by impairing viewof the device under test (DUT).

Lecroy sells a Dxx05 browser probe that uses a flex circuit ground: thisground mechanism has a limited span range and is fully exposed to thecustomer which makes it easily damaged. The variable ground span relieson the flexing of pc material so the slot between the tips has to befairly long. This long slot increases the loop area of the tip networkand causes excessive inductance. It is also not user-serviceable.Furthermore, since this is a flex circuit there is no variety of metalmaterials to choose from (e.g. only copper).

Tektronix's probe uses a wire loop for the ground mechanism which mayprovide good span range, but at small span ranges the bulk of the wireloop is un-utilized and cumbersome. Also, the wire geometry results inpoor loop inductance which sacrifices performance. The probe is fullyuser-exposed and user-serviceable by necessity.

In view of various shortcomings of conventional contact probes, theremay be a general need for improved approaches to maintain electricalcontact through the entire span range, maintain a low inductance groundpath, protect the probe from damage/abuse, allow for a large number ofspan adjustments/cycles, ease both manufacturing and assembly, reducecost and/or fit a variety of probe geometries.

BRIEF DESCRIPTION OF THE DRAWINGS

The example embodiments are best understood from the following detaileddescription when read with the accompanying drawing figures. It isemphasized that the various features are not necessarily drawn to scale.In fact, the dimensions may be arbitrarily increased or decreased forclarity of discussion. Wherever applicable and practical, like referencenumerals refer to like elements.

FIG. 1 is a perspective view of an embodiment of a handheld differentialcontact probe in accordance with features of the present invention.

FIG. 2 is a perspective view of an embodiment of the ground pathmechanism of the handheld differential contact probe of FIG. 1.

FIG. 3 is a schematic diagram of an embodiment of the ground pathmechanism of the handheld differential contact probe of FIG. 1.

FIG. 4 is a schematic diagram of another embodiment of the ground pathmechanism of the handheld differential contact probe of FIG. 1.

FIG. 5 is a flowchart illustrating a method of making a handhelddifferential contact probe according to a representative embodiment.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation andnot limitation, example embodiments disclosing specific details are setforth in order to provide a thorough understanding of an embodimentaccording to the present teachings. However, it will be apparent to onehaving ordinary skill in the art having the benefit of the presentdisclosure that other embodiments according to the present teachingsthat depart from the specific details disclosed herein remain within thescope of the appended claims. Moreover, descriptions of well-knownapparatuses and methods may be omitted so as to not obscure thedescription of the example embodiments. Such methods and apparatuses areclearly within the scope of the present teachings.

The terminology used herein is for purposes of describing particularembodiments only, and is not intended to be limiting. The defined termsare in addition to the technical and scientific meanings of the definedterms as commonly understood and accepted in the technical field of thepresent teachings.

As used in the specification and appended claims, the terms ‘a’, ‘an’and ‘the’ include both singular and plural referents, unless the contextclearly dictates otherwise. Thus, for example, ‘a device’ includes onedevice and plural devices. As used in the specification and appendedclaims, and in addition to their ordinary meanings, the terms‘substantial’ or ‘substantially’ mean to within acceptable limits ordegree. As used in the specification and the appended claims and inaddition to its ordinary meaning, the term ‘approximately’ means towithin an acceptable limit or amount to one having ordinary skill in theart. For example, ‘approximately the same’ means that one of ordinaryskill in the art would consider the items being compared to be the same

Relative terms, such as “above,” “below,” “top,” “bottom,” “upper” and“lower” may be used to describe the various elements' relationships toone another, as illustrated in the accompanying drawings. These relativeterms are intended to encompass different orientations of the deviceand/or elements in addition to the orientation depicted in the drawings.For example, if the device were inverted with respect to the view in thedrawings, an element described as “above” another element, for example,would now be “below” that element. Similarly, if the device were rotatedby 90° with respect to the view in the drawings, an element described“above” or “below” another element would now be “adjacent” to the otherelement; where “adjacent” means either abutting the other element, orhaving one or more layers, materials, structures, etc., between theelements.

Referring initially to FIGS. 1 and 2, a representative embodiment of ahandheld differential contact probe 10 will be described. The handhelddifferential contact probe 10 includes a housing 12 configured to beheld in a hand of a user. The housing 12 may be a shell-type housingthat defines an interior space for housing various components therein,for example. The housing 12 may be formed of plastic, for example. Apair of probe arms 14 is carried by the housing 12. Each of a pair ofopposing probe tip assemblies 16 is carried by one of the respectiveprobe arms 14. Each probe tip assembly 16 includes a probe tip circuit18, such as a printed circuit board (PCB), coupled to a probe tip 20 ata distal end thereof. The probe tip 20 of each probe tip assembly 16 maybe a pogo pin, for example, to provide compliance in the z-axis, i.e.away from the device under test (DUT).

A probe tip span adjustment mechanism 22 is carried by the housing 12and coupled to the pair of probe arms 14. The probe tip span adjustmentmechanism 22 is configured to adjust a span between the probe tips 20 aswould be appreciated by those skilled in the art. As illustrated, theprobe tip span adjustment mechanism 22 may be a thumb wheel (e.g. with acorresponding axes and/or gear mechanism. As illustrated, in anembodiment, a pair of signal connectors 24 (e.g. RF connectors) arecarried by the housing 12. Such signal connectors 24 are for connectionto an external instrument or device, e.g. such as an oscilloscope. Thesignal connectors 24 are coupled to respective probe tip circuits 18,for example, via corresponding transmission lines, e.g. coaxial cables26 and respective coaxial connectors 28.

A ground path mechanism 30 is coupled between the probe tip circuits 18of the respective probe tip assemblies 16, and includes a pair of curvedconductive ribbon springs 32 each coupled at an outer end 34 thereof toa respective probe tip circuit 18, and each curved conductive ribbonspring 32 slidably engaging each other at a respective inner end 36thereof. As illustrated in FIG. 2, the portion of the curved conductiveribbon springs 32 at the inner end 36, and not being used electricallyin the ground path, curls back into the wider area between the upperportions of the opposing probe tip assemblies 16, and so does notinterfere with the operation of probe tips 20 while adjacent a DUT.

In an embodiment, the opposing probe tip assemblies 16 are symmetrical,and each of the pair of curved conductive ribbon springs 32 issymmetrical. Each of the curved conductive ribbon springs 32 may includea copper alloy spring metal and gold plating. Each of the curvedconductive ribbon springs 32 may include a spring metal with at leastone of beryllium copper (BeCu), phosphor bronze and spring steel.

FIG. 3 is a schematic side view of an embodiment of the ground pathmechanism 30 and probe tip assemblies 16. Each of the curved conductiveribbon springs 32 may be a U-shaped conductive ribbon spring, e.g. asillustrated. Herein, the outer ends 34 are electrically coupled to arespective probe tip circuit 18, for example, via solder or adhesive.The inner end 36 of each curved conductive ribbon spring 32 slides (e.g.frictionally slides and/or rolls) against the inner end 36 of the othercurved conductive ribbon spring 32. Each of the curved conductive ribbonsprings 32 is configured to elastically deform and maintain electricalcontact with each other while the span between the probe tips 20 isadjusted by the probe tip span adjustment mechanism 22.

FIG. 4 is a schematic side view of another representative embodiment ofa ground path mechanism 40 and opposing probe tip assemblies 16, alsoreferred to herein as first and second probe tip assemblies. The groundpath mechanism 40 is coupled between the probe tip circuits 18 of thefirst and second probe tip assemblies 16, and includes at least onecurved conductive ribbon spring 42 configured to elastically deform andslidably maintain electrical coupling between the probe tip circuits 18of the first and second opposing probe tip assemblies while the spanbetween the probe tips 20 is adjusted by the probe tip span adjustmentmechanism 22.

As illustrated, the curved conductive ribbon spring 42 is a W-shapedconductive ribbon spring configured to elastically deform and, at outerends 44 thereof, slidably maintain electrical contact at the probe tipcircuits 18 of the first and second opposing probe tip assemblies 16while the span between the probe tips 20 is adjusted by the probe tipspan adjustment mechanism 22. Here, the center 46 of the W-shapedconductive ribbon spring is secured to the housing 12, e.g. via a pin48.

Alternatively, in other embodiments, the at least one curved conductiveribbon spring 42 may be a U-shaped conductive ribbon spring configuredto elastically deform and, at one end thereof, is coupled to a probe tipcircuit 18 of one probe tip assembly 16, while at the other end thereof,slidably maintains electrical contact at the probe tip circuit 18 of theother probe tip assembly 16 while the span between the probe tips 20 isadjusted by the probe tip span adjustment mechanism 22.

The various embodiments of ground path mechanisms 30/40, including thevarious described spring arrangements, may be provided in the handhelddifferential contact probe 10 of FIG. 1.

The described embodiments may provide various benefits compared toconventional handheld differential contact probes. For example, certainembodiments may provide advantages including maintaining electricalcontact through the entire span range, maintaining a low inductanceground path, protecting the probe from damage/abuse, allowing for alarge number of span adjustments/cycles, easing both manufacturing andassembly, reducing cost and/or fitting a variety of probe geometries.

A method aspect of the present embodiments will be described withadditional reference to the flowchart of FIG. 5. The method is formanufacturing the handheld differential contact probe 10. The methodbegins (block 60) and includes providing the pair of probe arms 14carried by the housing 12 at block 62. The method continues at block 64including providing the pair of opposing probe tip assemblies 16 eachcarried by one of the respective probe arms 14 and each comprising aprobe tip circuit 18 coupled to a probe tip 20 at a distal end thereof.The method includes coupling (at block 66) the probe tip span adjustmentmechanism 22, carried by the housing 12, to the pair of probe arms 14,to adjust the span between the probe tips 20. At block 68 the groundpath mechanism 30 is coupled between the probe tip circuits 18 of therespective probe tip assemblies 16, and includes a pair of curvedconductive ribbon springs 32 each coupled at an outer end 34 thereof toa respective probe tip circuit 18, and each curved conductive ribbonspring 32 slidably engaging each other at a respective inner end 36thereof, before the method ends (block 70).

Each of the curved conductive ribbon springs 32 may be configured toelastically deform and maintain electrical contact with each other whilethe span between the probe tips 20 is adjusted by the probe tip spanadjustment mechanism 22. In various embodiments, each of the curvedconductive ribbon springs 32 are formed by gold plating a copper alloyspring metal, or each of the curved conductive ribbon springs 32 isformed of a spring metal including at least one of beryllium copper(BeCu), phosphor bronze and spring steel.

This above described embodiments may provide more span range with asmaller ground loop area. From a practical viewpoint, this means it canmeasure a wider range of DUT geometries and get a higher-fidelitymeasurement at the same time. It may be a simpler mechanism thanconventional devices, which benefits cost, manufacturing, androbustness.

As discussed above, hand-held differential contact probes have a numberof challenges. Since these probes experience forces in virtually alldirections, tip mechanisms, including a ground mechanism, mustaccommodate this. Higher performance probes are typically smaller inphysical size, due to the physics of microwave electronics. Typicallymaterials that are robust with considerable compliance are notconductive and do not make good springs. The handheld differentialcontact probes need some way to maintain a mostly controlled impedanceas close to the tip as possible, and this region is very “mechanicallyactive” and needs to be physically very small.

In the present embodiments, metal components can be designed as springsand coated with very electrically conductive materials such as gold. Inthis way electrical contact is maintained and some mechanical complianceis achieved. The present embodiments use ribbon-shaped, spring metal(e.g. BeCu, spring steel, or phosphor bronze) in two shaped segmentsthat slide against each other, or in a single segment that slidesagainst one or both of the probe tip circuits, e.g. against the copperground plane of a PCB.

The present described embodiments may be referred to as PCB-basedbrowsers with pogo-pin tips. As mentioned above, the two sides of theprobe tip assemblies 16 may be identical/symmetrical, which greatlyreduces cost.

The present embodiments could also work with probe tips 20 that areadjusted around an axis of rotation. If the curved conductive ribbonsprings 32 are wide enough, they can tolerate considerable relative tipmovement in almost all directions and still make electrical contact. Thecurved conductive ribbon springs 32 could also have varying widths.These particular geometries, e.g. two semicircles slipping past eachother, may minimize the overall loop area through all spans, because theeffective ground contact slides closer to the probe tips 20 as the spanis reduced.

These springs can be epoxied or soldered to the bulk ground on the restof the probe body, which may be a PCB or a coaxial connector 28. Thediameter, width, and material thickness can all be varied to fit desiredinitial and final span ranges. Furthermore, the curved shape of thesprings does not need to be circular, e.g. it could be shaped to controlthe sliding differently, or to have more or less flexibility in certainspan ranges.

While representative embodiments are disclosed herein, one of ordinaryskill in the art appreciates that many variations that are in accordancewith the present teachings are possible and remain within the scope ofthe appended claim set. The invention therefore is not to be restrictedexcept within the scope of the appended claims.

1. A handheld contact probe comprising: first and second opposing probetip assemblies each comprising a probe tip circuit coupled to a probetip at a distal end thereof; a probe tip span adjustment mechanismconfigured to adjust a span between the probe tips; and a ground pathmechanism coupled between the probe tip circuits of the respective probetip assemblies, and comprising at least one curved conductive ribbonspring configured to elastically deform and slidably maintain electricalcoupling between the probe tip circuits of the first and second opposingprobe tip assemblies while the span between the probe tips is adjustedby the probe tip span adjustment mechanism, wherein the at least onecurved conductive ribbon spring comprises a W-shaped conductive ribbonspring configured to elastically deform and, at outer ends thereof,slidably maintain electrical contact at the probe tip circuits of thefirst and second opposing probe tip assemblies while the span betweenthe probe tips is adjusted by the probe tip span adjustment mechanism.2. The handheld contact probe of claim 1, wherein the probe tip circuitof each probe tip assembly comprises a printed circuit board.
 3. Thehandheld contact probe of claim 1, wherein the probe tip of each probetip assembly comprises a pogo pin.
 4. The handheld contact probe ofclaim 1, wherein the first and second opposing probe tip assemblies aresymmetrical.
 5. The handheld contact probe of claim 1, wherein the probetip circuit of each probe tip assembly comprises a printed circuitboard.
 6. The handheld contact probe of claim 1, wherein the probe tipof each probe tip assembly comprises a pogo pin.
 7. The handheld contactprobe of claim 1, wherein the W-shaped conductive ribbon springcomprises a copper alloy spring metal and gold plating.
 8. The handheldcontact probe of claim 1, wherein the W-shaped conductive ribbon springcomprises a metal including at least one of beryllium copper (BeCu),phosphor bronze and spring steel.
 9. The handheld contact probe of claim1, further comprising a pair of signal connectors carried by the housingand coupled to respective probe tip circuits via correspondingtransmission lines.
 10. A handheld contact probe comprising: first andsecond opposing probe tip assemblies each comprising a probe tip circuitcoupled to a probe tip at a distal end thereof; a probe tip spanadjustment mechanism configured to adjust a span between the probe tips;and a ground path mechanism coupled between the probe tip circuits ofthe respective probe tip assemblies, and comprising at least one curvedconductive ribbon spring configured to elastically deform and slidablymaintain electrical coupling between the probe tip circuits of the firstand second opposing probe tip assemblies while the span between theprobe tips is adjusted by the probe tip span adjustment mechanism,wherein at least one curved conductive ribbon spring comprises aU-shaped conductive ribbon spring configured to elastically deform and,at an first end thereof, is coupled to a probe tip circuit of the firstprobe tip assembly, and at a second end thereof, slidably maintainselectrical contact at the probe tip circuit of the second probe tipassembly while the span between the probe tips is adjusted by the probetip span adjustment mechanism.
 11. The handheld contact probe of claim10, wherein the probe tip circuit of each probe tip assembly comprises aprinted circuit board.
 12. The handheld contact probe of claim 10,wherein the probe tip of each probe tip assembly comprises a pogo pin.13. The handheld contact probe of claim 10, wherein the first and secondopposing probe tip assemblies are symmetrical.
 14. The handheld contactprobe of claim 10, wherein the probe tip circuit of each probe tipassembly comprises a printed circuit board.
 15. The handheld contactprobe of claim 10, wherein the probe tip of each probe tip assemblycomprises a pogo pin.
 16. The handheld contact probe of claim 10,wherein the W-shaped conductive ribbon spring comprises a copper alloyspring metal and gold plating.
 17. The handheld contact probe of claim10, wherein the W-shaped conductive ribbon spring comprises a metalincluding at least one of beryllium copper (BeCu), phosphor bronze andspring steel.
 18. The handheld contact probe of claim 10, furthercomprising a pair of signal connectors carried by the housing andcoupled to respective probe tip circuits via corresponding transmissionlines.